{"kind":"catalog","status":200,"org":"app","repo":"tsukuru","site":{"description":"部材 envelope から製品を設計し、AABB 干渉・公差 stack-up・挿入経路の物理 sim を通して、OpenUSD (usda) で NVIDIA Isaac Sim / Omniverse 互換に書き出す。設計の正本は cloud-itonami/tsukuru repo。","cid":null,"source":"https://github.com/cloud-itonami/app-itonami-tsukuru","ipns-key-item":null,"title":"tsukuru — 製品設計と物理 sim","ipns":null,"org":"app","files":["index.html","mk1-enclosure-sandwich.usda"],"repo":"tsukuru"},"origin":null,"bytes-url":null}